Showing 25–36 of 37 results
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- Semiconducting Properties: CuO is a p-type semiconductor, making it valuable for use in electronic devices.
- High Absorptivity: CuO has excellent light absorption properties, which is beneficial for solar energy applications.
- Chemical Stability: CuO coatings are chemically stable and can withstand environmental exposure, enhancing the durability of the films.
- Good Adhesion: CuO thin films demonstrate strong adhesion to various substrates, including glass, silicon, and metals.
- Easy Processing: CuO can be easily deposited using standard PVD techniques like thermal evaporation or electron-beam evaporation.
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- Semiconductor Properties: CuS is a p-type semiconductor, making it suitable for applications in photovoltaics and semiconductor devices.
- High Absorption: Copper Sulfide has strong light absorption characteristics, especially in the visible spectrum, making it ideal for solar energy applications.
- Customizable: CuS sputtering targets can be customized in terms of size, purity, and bonding options to meet specific deposition requirements.
- High Chemical Stability: CuS is chemically stable, which ensures the longevity and durability of the deposited thin films.
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- Semiconducting Properties: CuSe is a p-type semiconductor material, making it useful in the development of electronic and optoelectronic devices.
- High Absorption Coefficient: It has a high absorption coefficient in certain wavelengths, making it suitable for photovoltaic and optical coating applications.
- Stability: Copper selenide is stable under a wide range of conditions, providing longevity for deposited thin films in various environmental settings.
- Excellent Conductivity: The material demonstrates good electrical conductivity, which is valuable in the context of solar energy harvesting and thermoelectric applications.
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- High Purity: Ensures defect-free deposition for precision applications.
- Good Electrical Conductivity: Suitable for functional and conductive coatings.
- Stable Performance: Maintains chemical and thermal stability during sputtering processes.
- Customizable: Available in various dimensions and shapes for compatibility with sputtering systems.
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- Good Conductivity: Offers high electrical and thermal conductivity, making it ideal for electrical applications.
- Strength and Ductility: The alloy combines strength with ductility, allowing for effective deformation during soldering and manufacturing.
- Corrosion Resistance: Provides enhanced resistance to corrosion compared to pure copper.
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- High Electrical Conductivity: Copper’s exceptional conductivity is maintained while incorporating titanium’s benefits.
- Enhanced Corrosion Resistance: Titanium adds corrosion resistance, making the alloy suitable for harsh environments.
- Excellent Strength-to-Weight Ratio: The inclusion of titanium provides high strength while maintaining a low weight.
- Customizable Composition: Cu-Ti powder is available in various compositions to meet specific application requirements.
- Improved Durability: Suitable for high-stress, long-life applications due to the toughness of titanium.
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- Excellent Electrical Conductivity: High conductivity due to the copper content, making them ideal for electronic applications.
- Corrosion Resistance: Superior resistance to tarnishing and degradation in challenging environments.
- High Strength and Ductility: Combines durability with flexibility for various manufacturing needs.
- Thermal Conductivity: Efficient heat transfer for thermal management applications.
- Customizable Composition: Available in different Cu-Zn ratios to suit specific needs.
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- Balanced Alloy Composition: Combines Fe, Co, Ni, Al, Cu, and Ti for superior performance.
- High Strength and Durability: Exceptional mechanical properties for demanding environments.
- Thermal Stability: Operates efficiently under extreme temperature conditions.
- Corrosion Resistance: Excellent resistance to oxidation and environmental wear.
- Magnetic Properties: Suitable for applications requiring magnetic performance.
- Customizable Particle Sizes: Available in nano and micro scales for various uses.
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- Multi-Element Alloy: Balanced composition of Fe, Cu, Al, Cr, and Ni for enhanced properties.
- High Corrosion Resistance: Excellent resistance to oxidation and environmental degradation.
- Superior Mechanical Strength: Outstanding strength and durability for demanding applications.
- Thermal Stability: Maintains performance under high temperatures.
- Customizable Particle Sizes: Tailored for diverse manufacturing needs.
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- High Thermal Conductivity: Copper’s excellent thermal conductivity ensures effective heat dissipation in thin-film coatings, crucial for applications in electronics and thermal management systems.
- Mechanical Strength: Molybdenum contributes strength and rigidity to the MoCu alloy, ensuring mechanical stability in high-temperature and high-stress applications.
- Corrosion Resistance: The MoCu alloy provides good resistance to corrosion, making it suitable for use in environments where materials are exposed to moisture, chemicals, or harsh conditions.
- Low Thermal Expansion: The alloy’s combination of molybdenum and copper results in low thermal expansion, reducing the risk of film cracking or damage under thermal stress.
- Customizable Composition: The ratio of molybdenum to copper can be tailored to optimize the thermal, electrical, and mechanical properties to meet specific application requirements.
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- High Electrical Conductivity: NiCu alloy sputtering targets offer excellent electrical conductivity, making them ideal for thin films in electronic devices where efficient current flow is essential.
- Corrosion Resistance: The combination of nickel and copper provides strong corrosion resistance, allowing the thin films to withstand exposure to chemicals and harsh environments, such as marine and industrial settings.
- Magnetic Properties: NiCu alloys exhibit useful magnetic properties, which can be tailored for specific applications such as sensors, transformers, and other magnetic devices.
- Thermal Stability: NiCu alloy thin films maintain their structural integrity at elevated temperatures, making them suitable for high-temperature applications in aerospace and industrial settings.
- Customizable Composition: The ratio of nickel to copper can be adjusted to optimize the properties of the thin film for specific applications, such as enhancing conductivity or corrosion resistance.
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- High Electrical Conductivity: NiCuTi alloy sputtering targets deliver excellent electrical conductivity, making them ideal for use in electronic devices requiring efficient current flow and minimal energy loss.
- Corrosion Resistance: The addition of copper and titanium enhances the alloy’s ability to resist corrosion, particularly in environments exposed to chemicals, moisture, and salts.
- Enhanced Mechanical Strength: Titanium in the alloy improves the mechanical strength and wear resistance of NiCuTi thin films, making them suitable for applications requiring durability and high-stress tolerance.
- Thermal Stability: NiCuTi alloy thin films maintain their properties at high temperatures, making them suitable for aerospace and industrial applications involving elevated temperatures.
- Customizable Composition: The ratio of nickel, copper, and titanium in the alloy can be tailored to meet specific requirements, such as improving wear resistance or optimizing corrosion protection.
