Showing 13–14 of 14 results
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- Excellent Diffusion Barrier: TaN films provide an effective barrier against the diffusion of metals, such as copper, making them crucial for semiconductor devices.
- High Electrical Resistivity: TaN has a relatively high electrical resistivity, which makes it suitable for thin-film resistors and other resistive applications.
- Chemical and Thermal Stability: Tantalum Nitride exhibits excellent stability in extreme chemical and thermal environments, ensuring long-lasting performance in harsh conditions.
- Hardness and Wear Resistance: TaN films offer superior hardness and wear resistance, making them ideal for protective coatings in demanding industrial applications.
- Corrosion Resistance: TaN is resistant to corrosion, making it suitable for use in environments where exposure to chemicals or moisture is a concern.
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- Exceptional Mechanical Properties: Outstanding strength and ductility even at high temperatures.
- High-Temperature Stability: Retains structural integrity under extreme thermal conditions.
- Corrosion and Oxidation Resistance: Suitable for harsh and reactive environments.
- High Entropy Alloy: Unique multi-element composition for enhanced material performance.
- Customizable Particle Sizes: Nano to micrometer scales for diverse applications.