AlCu (Aluminum Copper) Pellets Granules Evaporation Materials

Description

Material	Aluminum Copper
Purity	99.5% – 99.9999% / 2N5 3N 3N5 4N 4N5 5N 5N5 6N
Shape	Pellets / Granules / Particles / Pieces
Size	can be customized (contact us)
Package	vacuum bag or customer’s request
Place of Origin	China
Supply Ability	1000kg per month
Lead Time	Qty: 1-100, Time: 3-10 days Qty: >100, Time: to be negotiated

 

AlCu (Aluminum Copper) pellets are a composite material combining aluminum and copper, used as evaporation materials in various thin-film deposition processes. This alloy is valued for its unique electrical, thermal, and mechanical properties, making it suitable for advanced applications in electronics and semiconductor manufacturing.

Key Applications:

• Interconnects in Electronics: AlCu is commonly used for creating interconnects in integrated circuits, enhancing conductivity and reducing electromigration.
• Thin-Film Coatings: Ideal for applications requiring thin-film deposition, including capacitors, sensors, and various electronic devices.
• Thermal Management: Utilized in thermal management solutions, leveraging the excellent thermal conductivity of copper.
• Optoelectronic Devices: Employed in optoelectronics for efficient light emission and conductivity.

Features:

• Enhanced Conductivity: The copper content improves the overall electrical conductivity compared to pure aluminum.
• Reduced Electromigration: AlCu reduces the risk of electromigration, enhancing the reliability of electronic components.
• Good Thermal Conductivity: Excellent heat dissipation properties due to the copper content.
• Versatile Deposition: Suitable for various deposition techniques, including thermal evaporation and sputtering.

Specifications:

• Material Composition: Aluminum-Copper Alloy
• Purity: Typically ≥ 99.5%
• Form: Pellets
• Size: Generally 1-6 mm in diameter (custom sizes available)
• Melting Point: Approximately 660°C (Al) and 1,085°C (Cu)
• Density: Varies with composition, typically around 2.7 g/cm³ (Al) and 8.96 g/cm³ (Cu)
• Deposition Methods: Suitable for thermal evaporation and sputtering techniques.
• Applications: Interconnects, thin-film coatings, thermal management solutions, optoelectronic devices.

Tinsan Materials offers high-purity AlCu (Aluminum-Copper) pellets for evaporation. Ideal for electronic interconnects, thin-film coatings, and thermal management. Available in custom sizes with ≥ 99.5% purity for superior conductivity and reliability.

If you have specific requirements, such as dimensions, purity, or application details, please contact us to match your needs.