AlN (Aluminum Nitride) Powder
- High Thermal Conductivity: Up to 180 W/m·K, ideal for heat dissipation in electronic devices.
- Excellent Electrical Insulation: High resistivity, suitable for high-voltage applications.
- Low Thermal Expansion: Matches well with silicon, reducing thermal stress in electronic assemblies.
- Chemical Stability: Resistant to chemical corrosion, even at high temperatures.
- Wide Applicability: Compatible with a variety of processing methods, including sintering and powder metallurgy.
- Customizable Particle Sizes: Available in nano-scale and micro-scale particle sizes to meet specific requirements.
Custom products or bulk orders, please contact us for competitive pricing!
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Description
Material | Aluminum Nitride (AlN) |
Purity | 99.8% – 99.999% / 2N8 3N 3N5 4N 4N5 5N |
Shape | powder / nanopowder / nanoparticles |
Size | can be customized (contact us) |
Package | bottle / bag or customer’s request |
Lead Time | Qty: 1-100, Time: 3-10 days
Qty: >100, Time: to be negotiated |
Aluminum Nitride (AlN) Powder, offered by Tinsan Materials, is a premium advanced ceramic material known for its excellent thermal conductivity, electrical insulation, and chemical stability. With a combination of exceptional properties, AlN powder is widely used in electronic, thermal management, and structural applications across multiple industries.
Key Features
- High Thermal Conductivity: Up to 180 W/m·K, ideal for heat dissipation in electronic devices.
- Excellent Electrical Insulation: High resistivity, suitable for high-voltage applications.
- Low Thermal Expansion: Matches well with silicon, reducing thermal stress in electronic assemblies.
- Chemical Stability: Resistant to chemical corrosion, even at high temperatures.
- Wide Applicability: Compatible with a variety of processing methods, including sintering and powder metallurgy.
- Customizable Particle Sizes: Available in nano-scale and micro-scale particle sizes to meet specific requirements.
Specifications
- Thermal Conductivity: Up to 180 W/m·K
- Purity: ≥ 99.8%
- Particle Size: Ranges from 0.5 µm to 10 µm (customizable)
- Density: 3.26 g/cm³
- Dielectric Strength: ≥ 10 MV/m
- Melting Point: ~2200°C
- Packaging: Available in vacuum-sealed containers to maintain purity and prevent moisture absorption.
Applications
- Electronics:
- Used as a substrate material in high-performance electronic circuits.
- Ideal for heat sinks and thermal management in power devices.
- LED Packaging:
- Enables efficient heat dissipation in high-brightness LED modules.
- Thermal Management:
- Essential for cooling systems in telecommunications and automotive electronics.
- Ceramics:
- Used in advanced ceramics for high-temperature structural components.
- Metal Matrix Composites:
- Acts as a reinforcement material to enhance the thermal properties of composites.
- Sintering Additive:
- Improves the densification and thermal performance of other ceramic materials.
Tinsan Materials’ Aluminum Nitride Powder combines high thermal conductivity, excellent electrical insulation, and outstanding chemical stability, making it a versatile material for cutting-edge applications. Its customizable particle sizes and purity levels ensure superior performance in thermal management, electronics, LED packaging, and advanced ceramics.
If you have specific requirements, such as sizes, purity, or application details, please contact us to match your needs.