AuSn (Gold Tin) Pellets Granules Evaporation Materials

Description

Material	Gold Tin (AuSn)
Purity	99.9% – 99.999% / 3N 3N5 4N 4N5 5N
Shape	Pellets / Granules / Particles / Pieces
Size	can be customized (contact us)
Package	vacuum bag or customer’s request
Supply Ability	1000kg per month
Lead Time	Qty: 1-100, Time: 3-10 days Qty: >100, Time: to be negotiated

 

Gold-Tin (AuSn) particles are advanced alloy materials renowned for their excellent soldering properties, high thermal and electrical conductivity, and reliability in high-temperature applications. These particles are commonly used in microelectronics, semiconductor packaging, and other precision industries that require strong, conductive, and thermally stable materials. Tinsan Materials provides high-purity AuSn particles with customizable sizes and compositions, offering a solution for demanding industrial and electronic applications.

Key Features

• Excellent Soldering Properties: Ideal for bonding and joining materials in microelectronics.
• High Thermal and Electrical Conductivity: Ensures efficient heat dissipation and electrical performance.
• Corrosion Resistance: Offers longevity and stability under harsh conditions.
• Stable at High Temperatures: Suitable for high-temperature soldering and welding applications.
• Customizable Sizes: Available in nano to micrometer scale for various uses.

Specifications

• Material: Gold-Tin (AuSn) Alloy
• Purity: ≥ 99.9%
• Particle Size: Nano to micrometer scale (customizable)
• Density: ~15.2 g/cm³
• Melting Point: ~280°C (AuSn eutectic composition)
• Hardness: ~90–120 HV (Vickers hardness)
• Composition: Customizable Au-Sn ratios (e.g., 80%-90% Au, 10%-20% Sn)
• Color: Metallic gold

Applications

• Microelectronics: Widely used in semiconductor packaging, bonding microchips, and connecting circuits.
• Soldering: Ideal for high-performance soldering applications in electronics, ensuring strong, conductive bonds.
• Automotive Electronics: Used for connections in high-temperature components such as sensors and control units.
• Aerospace Industry: Soldering of electronic components in high-performance, temperature-sensitive applications.
• LED and Optical Devices: Bonding materials in LED assemblies and optical components that require precise connections.

Gold-Tin (AuSn) particles are versatile and reliable materials, known for their excellent soldering capabilities, high conductivity, and temperature stability. Tinsan Materials offers high-quality AuSn particles with customizable compositions and sizes to support advanced microelectronics, semiconductor packaging, and other critical applications in industries requiring superior performance.

If you have specific requirements, such as dimensions, purity, or application details, please contact us to match your needs.