B Boron Sputtering Target
Boron (B) sputtering targets are high-purity materials used in physical vapor deposition (PVD) processes, particularly sputtering, to deposit thin films of boron onto various substrates. These targets are widely used in industries such as electronics, optics, and materials science due to boron’s unique properties.
Custom products or bulk orders, please contact us for competitive pricing!
- Satisfaction Guaranteed
- No Hassle Refunds
- Secure Payments
Description
Material | Boron (B) |
Purity | 99.9% – 99.9999% / 3N 3N5 4N 4N5 5N 5N5 6N |
Shape | disc, plate, sheet, rod, customized |
Size | can be customized (contact us) |
Package | vacuum bag or customer’s request |
Place of Origin | China |
MOQ | 1pc |
Supply Ability | 1000pcs per month |
Lead time | Qty: 1-100, Time: 3-10 days
Qty: >100, Time: to be negotiated |
Boron (B) sputtering targets are high-purity materials used in physical vapor deposition (PVD) processes, particularly sputtering, to deposit thin films of boron onto various substrates. These targets are widely used in industries such as electronics, optics, and materials science due to boron’s unique properties.
Key Features:
- Material: High-purity Boron (B), often with a purity level exceeding 99.9% (3N) or higher, is used to minimize impurities and ensure the quality of the deposited film.
- Form: Boron sputtering targets are typically available in different shapes, such as discs, rectangular plates, or custom geometries, depending on the specific needs of the application.
- Density: The density of boron sputtering targets is critical to ensure consistent deposition rates and uniform film thickness.
Applications: Used in the semiconductor industry for the production of boron-doped silicon, in optics for creating boron-based coatings, and in various advanced materials applications.
Considerations:
- Reactivity: Boron is highly reactive, especially at elevated temperatures, so it must be handled carefully to avoid contamination and oxidation. Sputtering targets are typically stored in vacuum-sealed packaging.
- Deposition Control: The sputtering process parameters, such as power, pressure, and substrate temperature, need to be carefully controlled to achieve the desired film characteristics, such as thickness, adhesion, and uniformity.
- Customization: Boron targets can be tailored to specific requirements in terms of size, shape, and purity to meet the needs of different applications.
Applications in Industry:
- Semiconductors: Used in doping silicon wafers to create p-type semiconductors in electronic devices, such as transistors and diodes.
- Optical Coatings: Employed in the production of thin films that enhance the optical properties of lenses, mirrors, and other optical components.
- Advanced Materials Research: Boron sputtering targets are used in the development of new materials with unique properties, such as high hardness, chemical resistance, and thermal stability.
If you have specific requirements, such as dimensions, purity, or application details, please contact us to match your needs.