Cu Copper Powder
- High Electrical and Thermal Conductivity: Ideal for electronic and heat transfer applications.
- High Purity: Minimal impurities to ensure reliable performance.
- Customizable Particle Sizes: Available in nano, micro, and spherical forms for versatile uses.
- Corrosion Resistance: Resistant to oxidation and environmental factors.
- Superior Sintering Properties: Enhances bonding and structural strength in metallurgical applications.
Custom products or bulk orders, please contact us for competitive pricing!
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Description
| Material | Copper (Cu) |
| Purity | 99.8% – 99.99% / 2N8 3N 3N5 4N |
| Shape | powder / nanopowder / nanoparticles |
| Size | can be customized (contact us) |
| Package | bottle / bag or customer’s request |
| Lead Time | Qty: 1-100, Time: 3-10 days
Qty: >100, Time: to be negotiated |
Copper (Cu) powder is a high-performance material widely used in electronics, metallurgy, and chemical industries. Tinsan Materials provides premium copper powder with exceptional conductivity and purity, suitable for applications such as powder metallurgy, electronic components, and additive manufacturing.
Key Features
- High Electrical and Thermal Conductivity: Ideal for electronic and heat transfer applications.
- High Purity: Minimal impurities to ensure reliable performance.
- Customizable Particle Sizes: Available in nano, micro, and spherical forms for versatile uses.
- Corrosion Resistance: Resistant to oxidation and environmental factors.
- Superior Sintering Properties: Enhances bonding and structural strength in metallurgical applications.
Specifications
- Material: Copper (Cu) Powder
- Purity: ≥ 99.8%
- Particle Size: Nano to micrometer scale (customizable)
- Density: ~8.96 g/cm³
- Melting Point: ~1,085°C
- Appearance: Reddish metallic powder
- Packaging: Vacuum-sealed or moisture-proof containers
Applications
- Powder Metallurgy: Used for manufacturing complex and high-strength parts.
- Electronics: Core material in circuits, connectors, and PCBs.
- Additive Manufacturing: Ideal for 3D printing conductive and structural components.
- Thermal Management: Utilized in heat exchangers and cooling systems.
- Coatings and Conductive Inks: Enhances performance in printing and surface treatments.
- Catalysts: Plays a key role in chemical reactions, including hydrogen production.
- Energy Storage: Used in battery electrodes and conductive layers.
Tinsan Materials’ high-purity Copper (Cu) powder delivers outstanding conductivity and versatile applications. Its customizable particle sizes and excellent sintering properties make it a preferred choice for advanced manufacturing and electronics.
If you have specific requirements, such as sizes, purity, or application details, please contact us to match your needs.
