CuSn (Copper Tin) Pellets 5N (99.999%) Granules Evaporation Materials
- Good Conductivity: Offers high electrical and thermal conductivity, making it ideal for electrical applications.
- Strength and Ductility: The alloy combines strength with ductility, allowing for effective deformation during soldering and manufacturing.
- Corrosion Resistance: Provides enhanced resistance to corrosion compared to pure copper.
Custom products or bulk orders, please contact us for competitive pricing!
- Satisfaction Guaranteed
- No Hassle Refunds
- Secure Payments
Description
| Material | Copper Tin |
| Purity | 99% – 99.999% / 2N 2N5 3N 3N5 4N 4N5 5N |
| Shape | Pellets / Granules / Particles / Pieces |
| Size | can be customized (contact us) |
| Package | vacuum bag or customer’s request |
| Place of Origin | China |
| Supply Ability | 1000kg per month |
| Lead Time | Qty: 1-100, Time: 3-10 days
Qty: >100, Time: to be negotiated |
CuSn pellets are composed of a binary alloy of copper and tin, often used in applications that require good electrical conductivity and mechanical strength. This alloy is commonly employed in the production of solder and other electronic components.
Key Applications:
- Soldering: Used in electronic assemblies and circuit boards as a primary solder material due to its excellent wetting properties.
- Electrical Contacts: Suitable for components requiring good conductivity and resistance to corrosion.
- Tribological Applications: Employed in bearings and bushings where wear resistance and lubrication are crucial.
Features:
- Good Conductivity: Offers high electrical and thermal conductivity, making it ideal for electrical applications.
- Strength and Ductility: The alloy combines strength with ductility, allowing for effective deformation during soldering and manufacturing.
- Corrosion Resistance: Provides enhanced resistance to corrosion compared to pure copper.
Specifications:
- Material Composition: Copper Tin (CuSn)
- Purity: Typically ≥ 99%
- Form: Pellets
- Size: Commonly 1-10 mm in diameter (custom sizes available)
- Melting Point: Approximately 900°C
- Density: About 8.9 g/cm³
- Deposition Methods: Suitable for thermal evaporation and sputtering processes in thin-film applications.
Tinsan Materials offers high-purity CuSn (Copper Tin) pellets for evaporation. Ideal for soldering and electrical applications, offering excellent conductivity and corrosion resistance with ≥ 99% purity. Available in various sizes for advanced electronic manufacturing.
If you have specific requirements, such as dimensions, purity, or application details, please contact us to match your needs.
