Pb Lead Sputtering Target

Description

Material	Lead (Pb)
Purity	99.9% – 99.9999% / 3N 3N5 4N 4N5 5N 5N5 6N
Shape	disc, plate, sheet, rod, customized
Size	can be customized (contact us)
Package	vacuum bag or customer’s request
Place of Origin	China
MOQ	1pcs
Supply Ability	1000pcs per month
Lead Time	Qty: 1-100, Time: 3-10 days Qty: >100, Time: to be negotiated

 

Key Features:

• Purity: Lead sputtering targets are typically available in high purity levels, such as 99.99% (4N) or higher, ensuring the deposition of high-quality and uniform films.
• Shapes and Sizes: These targets are available in various forms, including discs, plates, and custom shapes, tailored to fit different sputtering systems and specific application requirements.

Applications:

• Semiconductor Industry: In certain specialized semiconductor applications, lead is used in the creation of thin films that can serve as protective layers, electrodes, or in the fabrication of specific electronic components where lead’s unique properties are required.
• Superconductors: Lead is sometimes used in the development of superconducting materials, particularly in the creation of thin films for research and applications in low-temperature superconductivity.
• Radiation Shielding: Lead’s high density and ability to absorb radiation make it an ideal material for thin films used in radiation shielding applications. This includes coatings for medical imaging devices, X-ray equipment, and protective barriers.
• Battery Technology: While more common in bulk form, lead thin films may also play a role in research and development related to lead-acid batteries or other energy storage systems.

Customization Options:

• Thickness: The thickness of the lead coating can be precisely controlled during the sputtering process, allowing for tailored solutions to meet specific application needs.
• Alloys: Lead sputtering targets can be produced as pure lead or in alloyed forms, such as lead-tin (Pb-Sn) or lead-silver (Pb-Ag), depending on the desired properties of the thin film.
• Backing Plates: Lead targets can be bonded to backing plates made from materials like copper or aluminum to improve thermal conductivity and mechanical stability during the sputtering process.

Lead (Pb) sputtering targets are used in physical vapor deposition (PVD) processes to deposit thin lead films onto various substrates. Lead is a heavy metal known for its high density, malleability, and corrosion resistance, making it suitable for specific niche applications, particularly in the electronics, shielding, and superconductivity sectors.

If you have specific requirements, such as dimensions, purity, or application details, please contact us to match your needs.