Ru Ruthenium Sputtering Target
Ruthenium (Ru) sputtering targets are used in physical vapor deposition (PVD) processes to create thin films and coatings on various substrates. Ruthenium, a platinum group metal, is valued for its excellent hardness, corrosion resistance, and high melting point, making it ideal for applications in electronics, data storage, and catalysis.
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Description
| Material | Ruthenium (Ru) |
| Purity | 99.9% – 99.999% / 3N 3N5 4N 4N5 5N |
| Shape | disc, plate, sheet, rod, customized |
| Size | can be customized (contact us) |
| Package | vacuum bag or customer’s request |
| Place of Origin | China |
| MOQ | 1pc |
| Supply Ability | 1000pcs per month |
| Lead time | Qty: 1-100, Time: 3-10 days
Qty: >100, Time: to be negotiated |
Ruthenium (Ru) sputtering targets are used in physical vapor deposition (PVD) processes to create thin films and coatings on various substrates. Ruthenium, a platinum group metal, is valued for its excellent hardness, corrosion resistance, and high melting point, making it ideal for applications in electronics, data storage, and catalysis.
Key Features:
- Purity: Ruthenium sputtering targets are typically available with high purity levels, such as 99.95% (3N5) or higher, to ensure the quality and consistency of the deposited films.
- Shapes and Sizes: These targets can be produced in various shapes, including discs, plates, or cylinders, and customized to fit specific sputtering systems.
Applications:
- Electronics: Ruthenium coatings are used in semiconductor devices, particularly in the production of conductive layers and as a barrier layer in copper interconnects.
- Data Storage: Thin films of ruthenium are applied in the magnetic recording industry, particularly in hard disk drives, to enhance data storage capacity and performance.
- Catalysis: Ruthenium coatings are also utilized in chemical catalysis, particularly in the production of catalytic converters and fuel cells.
Customization Options:
- Thickness: The thickness of the ruthenium coating can be precisely controlled during the sputtering process, allowing for tailored solutions to meet specific application requirements.
- Backing Plates: Ruthenium sputtering targets can be bonded to backing plates made from materials like copper or molybdenum to improve thermal conductivity and structural stability during the sputtering process.
Ruthenium (Ru) sputtering targets are essential for industries requiring durable, high-performance thin films, particularly in advanced electronics and data storage technologies.
If you have specific requirements, such as dimensions, purity, or application details, please contact us to match your needs.
