Sn Tin Sputtering Targets
- High Purity: Typically available in purities of 99.9% (3N) to 99.9999% (6N), ensuring high-quality deposition with minimal impurities.
- Good Conductivity: Tin is an excellent conductor of electricity, making it ideal for electronic and semiconductor applications.
- Corrosion Resistance: Exhibits resistance to oxidation and corrosion, ensuring durable and stable coatings.
- Low Melting Point: Tin has a relatively low melting point (232°C), facilitating efficient sputtering processes.
- Versatility: Suitable for creating uniform films in a range of applications, including electronic, decorative, and optical coatings.
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Description
| Material | Tin (Sn) |
| Purity | 99.9% – 99.9999% / 3N 3N5 4N 4N5 5N 5N5 6N |
| Shape | disc, plate, sheet, rod, customized |
| Size | can be customized (contact us) |
| Package | vacuum bag or customer’s request |
| Place of Origin | China |
| MOQ | 1pcs |
| Supply Ability | 10000pcs per month |
| Lead Time | Qty: 1-100, Time: 3-10 days
Qty: >100, Time: to be negotiated |
Tin (Sn) sputtering targets are high-purity metallic materials used in physical vapor deposition (PVD) processes, such as sputtering, to create thin films and coatings. Tin is a soft, malleable, silvery-white metal with excellent corrosion resistance and good electrical conductivity, making it a valuable material for various industries, including electronics, optics, and protective coatings.
Key Features:
- High Purity: Typically available in purities of 99.9% (3N) to 99.9999% (6N), ensuring high-quality deposition with minimal impurities.
- Good Conductivity: Tin is an excellent conductor of electricity, making it ideal for electronic and semiconductor applications.
- Corrosion Resistance: Exhibits resistance to oxidation and corrosion, ensuring durable and stable coatings.
- Low Melting Point: Tin has a relatively low melting point (232°C), facilitating efficient sputtering processes.
- Versatility: Suitable for creating uniform films in a range of applications, including electronic, decorative, and optical coatings.
Specifications:
- Material Composition: Tin (Sn)
- Purity Levels: 99.9% (3N), 99.99% (4N), 99.999% (5N), 99.9999% (6N)
- Shape:
- Disc
- Plate
- Cylinder
- Dimensions: Customizable based on deposition equipment requirements
- Diameter Range: 1″ to 12″ or as per specifications
- Thickness: From 0.1mm to several millimeters
- Density: 7.31 g/cm³
- Surface Finish: Fine machined, polished
Applications:
- Electronics: â‘ Used in the deposition of conductive layers in PCBs, semiconductors, and microelectronics. â‘¡Tin coatings are used for solderability in electronic components.
- Optics: For creating reflective and protective coatings on glass and optical devices.
- Decorative Coatings: Applied to decorative items for a shiny, corrosion-resistant finish.
- Protective Coatings: Tin layers are used as barriers to protect underlying materials from corrosion and wear.
- Energy Applications: Tin coatings are used in photovoltaic cells and energy storage devices.
- Tribological Coatings: Thin tin films can reduce friction and wear in mechanical components.
Advantages of Tin Sputtering Targets:
- Uniform Thin Films: Produces high-quality, defect-free coatings with excellent adhesion.
- Recyclable Material: Tin sputtering targets can often be recycled for cost efficiency and sustainability.
- Customizable Specifications: Available in various shapes, sizes, and purities to meet specific industrial or research needs.
Storage and Handling:
- Storage: Store in a dry, clean environment to prevent oxidation.
- Handling: Avoid exposure to moisture and contaminants to maintain purity.
If you have specific requirements, such as dimensions, purity, or application details, please contact us to match your needs.
