TiSi2 (Titanium Silicide) Sputtering Targets
- High Electrical Conductivity: Enables efficient current flow in thin films.
- Thermal Stability: Performs well under high-temperature conditions.
- High Purity: Ensures minimal impurities for precise and reliable deposition.
- Versatility: Suitable for a wide range of deposition techniques, including magnetron sputtering.
- Customizable Specifications: Tailored to meet the demands of diverse applications.
Custom products or bulk orders, please contact us for competitive pricing!
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Description
| Material | Titanium Silicide (TiSi₂) |
| Purity | 99.9% – 99.9999% / 3N 3N5 4N 4N5 5N 5N5 6N |
| Shape | disc, plate, sheet, rod, customized |
| Size | can be customized (contact us) |
| Package | vacuum bag or customer’s request |
| Place of Origin | China |
| MOQ | 1pcs |
| Supply Ability | 10000pcs per month |
| Lead Time | Qty: 1-100, Time: 3-10 days
Qty: >100, Time: to be negotiated |
Titanium Silicide (TiSi₂) sputtering targets are widely used in advanced thin-film deposition processes, offering excellent electrical conductivity, high-temperature stability, and compatibility with silicon-based devices. Known for their reliability in creating ohmic contacts and barrier layers, these targets are essential in the semiconductor, electronics, and photovoltaic industries. Produced with high purity and precision, TiSi₂ sputtering targets ensure consistent performance and superior film quality.
Key Applications
- Semiconductor Industry: Contact and interconnect layers in IC manufacturing.
- Microelectronics: Thin-film transistors and MEMS devices.
- Photovoltaics: Conductive layers for solar cell technologies.
- Barrier Layers: Preventing diffusion in multilayer structures.
Features and Benefits
- High Electrical Conductivity: Enables efficient current flow in thin films.
- Thermal Stability: Performs well under high-temperature conditions.
- High Purity: Ensures minimal impurities for precise and reliable deposition.
- Versatility: Suitable for a wide range of deposition techniques, including magnetron sputtering.
- Customizable Specifications: Tailored to meet the demands of diverse applications.
Specifications
- Chemical Formula: TiSi₂.
- Purity: ≥ 99.9%.
- Density: ~4.2 g/cm³.
- Target Shapes: Circular, rectangular, or custom geometries.
- Dimensions: Available in various sizes to fit sputtering systems.
Customization Options
- Target Dimensions: Adjustable sizes and shapes to match specific equipment.
- Bonding Services: Backing plate bonding for enhanced thermal management.
- Purity Grades: Ultra-high purity options for critical applications.
- Surface Finish: Polished or machined surfaces for optimal sputtering performance.
Explore the potential of Titanium Silicide (TiSi₂) sputtering targets for your thin-film deposition needs. Contact us to learn more about our products and discuss your specific requirements.
