Showing 25–36 of 525 results
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- Enhanced Strength: Molybdenum contributes to higher strength and stability at elevated temperatures.
- Good Thermal Conductivity: Provides effective heat dissipation in electronic applications.
- Corrosion Resistance: Offers improved resistance against oxidation and wear.
- Versatile Deposition: Compatible with thermal evaporation and sputtering techniques.
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- High Thermal Conductivity: AlN offers one of the highest thermal conductivities among non-metals, which is vital for heat dissipation in high-power electronics and optoelectronics.
- Electrical Insulation: AlN is an excellent electrical insulator, making it suitable for electronic applications requiring electrical isolation with effective thermal management.
- Piezoelectric Properties: AlN exhibits strong piezoelectric properties, making it ideal for use in sensors, actuators, and acoustic wave devices.
- High Hardness and Durability: AlN films are mechanically robust, offering good wear resistance and durability for applications in harsh environments.
- Good Chemical Stability: AlN is resistant to many chemicals and environmental conditions, ensuring longevity in demanding applications.
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- Thin-Film Deposition: AlN pellets are used as a source material in Physical Vapor Deposition (PVD) techniques, such as sputtering and electron beam evaporation, to create thin AlN coatings on substrates. These coatings are utilized for microelectronics, optoelectronics, and protective layers.
- Thermal Management: Used in industries requiring materials with high thermal conductivity for heat dissipation, like LEDs and high-power semiconductors.
- Ceramic Engineering: AlN pellets are employed in developing advanced ceramics for aerospace, automotive, and electronic industries.
- Optical Applications: Ideal for infrared optics due to good transparency in the IR range.
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- High Thermal Conductivity: Up to 180 W/m·K, ideal for heat dissipation in electronic devices.
- Excellent Electrical Insulation: High resistivity, suitable for high-voltage applications.
- Low Thermal Expansion: Matches well with silicon, reducing thermal stress in electronic assemblies.
- Chemical Stability: Resistant to chemical corrosion, even at high temperatures.
- Wide Applicability: Compatible with a variety of processing methods, including sintering and powder metallurgy.
- Customizable Particle Sizes: Available in nano-scale and micro-scale particle sizes to meet specific requirements.
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- High Strength-to-Weight Ratio: Combines the lightweight nature of aluminum with the strength of niobium.
- Improved Thermal Stability: Suitable for high-temperature applications without significant degradation.
- Corrosion Resistance: Offers enhanced resistance to oxidation and wear in harsh environments.
- Versatile Processing: Compatible with various deposition techniques including thermal evaporation and sputtering.
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- Corrosion Resistance: Offers good resistance to oxidation and corrosion.
- Enhanced Strength: Combines the lightweight nature of aluminum with the strength of nickel.
- Magnetic Properties: Displays useful magnetic characteristics for specific applications.
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- Lightweight: Combines the lightweight nature of aluminum with the strength-enhancing effects of scandium.
- Improved Strength: Significantly increases yield strength and fatigue resistance.
- Corrosion Resistance: Offers good resistance to oxidation, making it suitable for harsh environments.
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- Excellent Electrical Conductivity: AlSi alloys offer good electrical conductivity, making them ideal for interconnect layers and conductive films in electronic devices.
- Thermal Stability: AlSi films exhibit high thermal stability, ensuring reliable performance in high-temperature environments, such as semiconductor processing.
- Prevention of Electromigration: The addition of silicon to aluminum helps mitigate electromigration, improving the longevity and reliability of electronic components.
- Corrosion Resistance: AlSi alloys have good resistance to oxidation and corrosion, contributing to the durability of thin films in harsh operating conditions.
- Lightweight and Strong: The lightweight nature of aluminum, combined with the added strength from silicon, makes AlSi alloys versatile in applications requiring both durability and reduced weight.
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- Enhanced Strength: The addition of silicon increases tensile strength and hardness.
- Good Fluidity: Excellent flow properties make it suitable for casting and evaporation processes.
- Corrosion Resistance: Offers good resistance to oxidation and chemical exposure.
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- High Strength-to-Weight Ratio: AlSi10Mg powder delivers a high strength-to-weight ratio, making it suitable for lightweight but robust components.
- Excellent Corrosion Resistance: Offers superior resistance to corrosion, ideal for use in harsh environments.
- Good Castability: Provides excellent castability, ensuring high-quality results in additive manufacturing.
- Enhanced Thermal Conductivity: Offers good thermal conductivity, making it ideal for heat-dissipating applications.
- Low Shrinkage: Exhibits minimal shrinkage during the additive manufacturing process, ensuring high precision.
- Ease of Post-Processing: The material can be easily post-processed, including machining, anodizing, and surface treatment.
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- Electrical Conductivity: The presence of aluminum and copper in the alloy enhances the electrical conductivity of the deposited thin films, making it ideal for semiconductor and electronic applications.
- Thermal Stability: AlSiCu alloy films exhibit excellent thermal performance, ensuring stability in high-temperature environments like semiconductor fabrication and automotive electronics.
- Mechanical Strength: Silicon contributes to the mechanical durability of the alloy, providing resistance to wear and cracking in thin films, which is essential in demanding applications.
- Corrosion Resistance: The alloy offers good resistance to corrosion, ensuring longevity in exposed environments, such as automotive electronics and solar cells.
- Customizable Size and Shape: AlSiCu sputtering targets can be produced in various forms, including discs, plates, and custom shapes, to suit different PVD systems and specific requirements.
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- Improved Strength: Copper enhances the overall tensile strength and thermal stability.
- Excellent Conductivity: High electrical conductivity makes it suitable for electrical applications.
- Corrosion Resistance: Maintains performance under oxidative conditions.
